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NTHS2101P
Power MOSFET
?8.0 V, ?7.5 A P?Channel ChipFET t
Features
? Offers an Ultra Low R DS(on) Solution in the ChipFET Package
? Miniature ChipFET Package 40% Smaller Footprint than TSOP?6
making it an Ideal Device for Applications where Board Space is at a
http://onsemi.com
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Premium
Low Profile (<1.1 mm) Allows it to Fit Easily into Extremely Thin
Environments such as Portable Electronics
Designed to Provide Low R DS(on) at Gate Voltage as Low as 1.8 V, the
Operating Voltage used in many Logic ICs in Portable Electronics
Simplifies Circuit Design since Additional Boost Circuits for Gate
Voltages are not Required
Operated at Standard Logic Level Gate Drive, Facilitating Future
Migration to Lower Levels using the same Basic Topology
Pb?Free Package is Available
V (BR)DSS
?8.0 V
Ultra Low R DS(on) TYP
19 m W @ ?4.5 V GS
25 m W @ ?2.5 V GS
34 m W @ ?1.8 V GS
S
G
I D MAX
?7.5 A
Applications
? Optimized for Battery and Load Management Applications in
Portable Equipment such as MP3 Players, Cell Phones, Digital
D
?
?
Cameras, Personal Digital Assistant and other Portable Applications
Charge Control in Battery Chargers
Buck and Boost Converters
P?Channel MOSFET
ChipFET
CASE 1206A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
STYLE 1
Rating
Symbol
Value
Unit
Drain?to?Source Voltage
Gate?to?Source Voltage ? Continuous
V DSS
V GS
?8.0
" 8.0
Vdc
Vdc
PIN
CONNECTIONS
MARKING
DIAGRAM
Drain Current
? Continuous
? 5 seconds
I D
?5.4
?7.5
A
D
8
1
D
1
8
Total Power Dissipation
Continuous @ T A = 25 ° C
(5 sec) @ T A = 25 ° C
Continuous @ 85 ° C
(5 sec) @ 85 ° C
P D
1.3
2.5
0.7
1.3
W
D
D
S
7
6
5
2
3
4
D
D
G
2
3
4
7
6
5
Continuous Source Current
Thermal Resistance (Note 1)
Junction?to?Ambient, 5 sec
Junction?to?Ambient, Continuous
Is
R q JA
?1.1
50
95
A
° C/W
D4 = Specific Device Code
M = Month Code
ORDERING INFORMATION
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
T L
260
° C
Device
Package
Shipping ?
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
NTHS2101PT1
NTHS2101PT1G
ChipFET
ChipFET
3000/Tape & Reel
3000/Tape & Reel
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
(Pb?Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2004
October, 2004 ? Rev. 4
1
Publication Order Number:
NTHS2101P/D
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